About GTS
Product & technology
News dynamics
ESG
Join GTS
Contact Us
CN
Vision

Become a world-class IC technology and

solution integrator

Packaging substrate
of semiconductor chip packaging uses high-precision circuits to provide signal connection and heat dissipation protection for the chip.
FCBGA
SiP
Memory
FCCSP
WBCSP
MEMS
solution integrator
Push forward continuous innovation, assist customers to build a more application-rich ecology
Memory
AP
RF
Microphone
Sensor
PMIC
Fingerprint
News dynamics查看更多 >
New Journy, New Growth – 2022 Golden Seed Culture Training Concludes
GTS Makes an Appearance on SEMICON China 2023
About GTS
Product and technology
News dynamics
ESG
Join GTS
Contact Us
Copyright © GreaTech Substrates Co., Ltd. All rights reserved
Yue ICP Bei No. 2023069876
Guangdong public network security No. 44030502003055
Contact Us | Legal statement | Privacy policy　Technical support: Yisheng Culture Communication